RIGID PCB
Basematerial | Layers | Surface | Soldermask |
---|---|---|---|
CEM1 | Single layer | HASL (horizontal and vertical) | Liquid- and dry film |
FR2 | Double layer (0.4-2.4mm) | ENTEK MEC Flux coating | Carbonprint |
FR4 | Multilayer 4-8 Lagen (0.8-2.4mm) | Flashgold (galvanic) | Detachable soldermask |
Copper 12,5-70µm | hard gold plating |